Diamonds Are a Tech Bro’s Best Friend: How MIT is Bling-Cooling Next-Gen Wireless Chips

Researchers at MIT have developed a groundbreaking chipmaking technique that embeds high-performance gallium nitride (GaN) transistors directly into an ultrathin layer of lab-grown diamond to radically cool down wireless electronics. By utilizing diamond as an internal heat spreader, this new method prevents the localized hotspots that typically plague advanced semiconductors. This allows next-generation hardware to…

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